Synthesis of conductive adhesives based on epoxy resin/nanopolyaniline and chloroprene rubber/nanopolyaniline: Characterization of thermal,mechanical and electrical properties

Abstract

Dodecylbenzenesulfonic acid-doped polyaniline was prepared by sonication method. Electrically conductive blends were prepared by mixing a polyaniline–dodecylbenzenesulfonic acid salt with epoxy resin and chloroprene rubber. The nanostructure of the conductive blends was studied by scanning electron microscopy. The polyaniline/epoxy resin and polyaniline/chloroprene rubber showed threshold concentrations of polyaniline (5 and 10 wt%, respectively) for electrical conduction. The electrical conductivity of both polyaniline/epoxy resin and polyaniline/chloroprene rubber increased with the addition of polyaniline–dodecylbenzenesulfonic acid, reaching values higher than 1.89 × 10⁻² and 7.50 × 10⁻⁴ S/cm with 50 wt% of polyaniline–dodecylbenzenesulfonic acid. The structures of conductive adhesives were investigated by Fourier transform infrared spectroscopy. Also the thermal, mechanical, and adhesion strength properties of blends containing different amounts of polyaniline–dodecylbenzenesulfonic acid were determined.