Nylon 6 (PA6) thermal conductive composites were prepared by melt blending with different sizes of spherical Al2O3 and AlN and the filling amount was 60 wt%. This paper explored the effects of different particle sizes and filler kinds on the thermal conductivity and mechanical properties of the composites. The results showed that the composites filled with AlN and spherical Al2O3 had higher thermal conductivity than the composites filled with single filler under the same filling amount. When the mass ratio of 48 μm spherical Al2O3 and 14 μm AlN was 1:2, the thermal conductivity and thermal diffusivity was 2.44 W/(m·K) and 0.72 mm2/s, respectively. In addition,the tensile strength was 57.50 MPa and the impact strength was 6.13 KJ/m2. By comparing actual thermal conductivity value with the theoretical value calculated by Agari model, we found that actual value of alumina filling was close to the theoretical value.
ZhouWY, YuDM, WangC, Effect of filler size distribution on the mechanical and physical properties of alumina-filled silicone rubber. Polym Eng Sci. 2008;48(7):1381–1388. doi: 10.1002/pen.21113
2.
ZwebenC.Metal-matrix composites for electronic packaging. JOM. 1992;44(7):15–23. doi: 10.1007/BF03222270
Zhou YC, WangH, WangL, Fabrication and characterization of aluminum nitride polymer matrix composites with high conductivity and low dielectric constant for electronic packaging. Mater Sci Eng B. 2012;177(11):892–896. doi: 10.1016/j.mseb.2012.03.056
5.
MooreAL, ShiL.Emerging challenges and materials for thermal management of electronics. Mater Today. 2014;17(4):163–174. doi: 10.1016/j.mattod.2014.04.003
6.
MallikS, EkereN, BestC, Investigation of thermal management materials for automotive electronic control units. Appl Therm Eng. 2011;31(2–3):355–362. doi: 10.1016/j.applthermaleng.2010.09.023
7.
WongCP, BollampallyRS.Thermal conductivity, elastic modulus and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging. J Appl Polym Sci. 1999;74(14):3396–3403. doi: 10.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-3
8.
ZhouT, XinW, LiuX, Improved thermal conductivity of epoxy composites using a hybrid multi-walled carbon nanotube/micro-SiC filler. Carbon. 2010;48(4):1171–1176. doi: 10.1016/j.carbon.2009.11.040
9.
ShiZ, FuR, AgathopoulosS, Thermal conductivity and fire resistance of epoxy molding compounds filled with Si3N4 and Al(OH)3. Mater Des. 2012;34:820–824. doi: 10.1016/j.matdes.2011.07.012
10.
LeivoEM, KellbergTH, KolariMJ.Structure and thermal conductivity of flame sprayedpolyamide 11 coatings filled with Al2O3, AlN and BN ceramics. Proceedings of International Thermal Spray Conference, 2001 May 28–30; Singapore.2001. p. 327–330, ASM.
11.
YuH, LiLL, QiLH.2011. Viscosity and thermal conductivity of alumina microball/epoxy composites. 2011 International Conference on Electronic Packaging Technology & High Density Packaging. Shanghai, China.
12.
FuJF, ShiLY, ZhongQD, Thermal conductive and electrically insulative nanocomposites based on hyperbranched epoxy and nano-Al2O3 particles modified epoxy resin. Polym Adv Technol. 2011;22(6):1032–1041. doi: 10.1002/pat.1638
13.
HongJP, YoonSW, HwangT, High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitridefillers. Thermochim Acta. 2012;537(11):70–75. doi: 10.1016/j.tca.2012.03.002
14.
ZhouW, QiS, TuC, Effect of the particle size of Al2O3 on the properties of filled heat-conductive silicone rubber. J Appl Polym Sci. 2007;104(2):1312–1318. doi: 10.1002/app.25789
15.
SmithDK, PantoyaML.Effect of nanofiller shape on effective thermal conductivity of fluoropolymer composites. Compos Sci Technol. 2015;118:251–256. doi: 10.1016/j.compscitech.2015.09.010
16.
ChoiS, KimJ.Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers. Compos Part B. 2013;51:140–147. doi: 10.1016/j.compositesb.2013.03.002
KwonSY, KwonIM, KimYG, A large increase in the thermal conductivity of carbon nanotube/polymer composites produced by percolation phenomena. Carbon. 2013;55(2):285–290. doi: 10.1016/j.carbon.2012.12.063
19.
ChungS, ImY, KimH, Evaluation for micro scale structures fabricated using epoxy-aluminum particle composite and its application. J Mater Process Technol. 2005;160(2):168–173. doi: 10.1016/j.jmatprotec.2004.06.004
20.
AgariY, TanakaM.Thermal conductivity of a polymer composite filled with mixtures of particles. J Appl Polym Sci. 1987;34:1429–1437. doi: 10.1002/app.1987.070340408
21.
AgariY, UedaA, NagaiS.Thermal conductivity of a polymer composite. J Appl Polym Sci. 1993;49(9):1625–1634. doi: 10.1002/app.1993.070490914
22.
YuW, XieH, YinL, Exceptionally high thermal conductivity of thermal grease: synergistic effects of graphene and alumina. Int J Therm Sci. 2015;91:76–82. doi: 10.1016/j.ijthermalsci.2015.01.006
23.
LiM, WanY, GaoZ, Preparation and properties of polyamide 6 thermal conductive composites reinforced with fibers. Mater Des. 2013;51(5):257–261. doi: 10.1016/j.matdes.2013.03.076
ZhuBL, MaJ, WuJ, Study on the properties of the epoxy-matrix composites filled with thermally conductive AlN and BN ceramic particles. J Appl Polym Sci. 2010;118(5):2754–2764. doi: 10.1002/app.32673
26.
LeeGW, ParkM, KimJ, Enhanced thermal conductivity of polymer composites filled with hybrid filler. Compos Part A Appl Sci Manuf. 2006;37(5):727–734. doi: 10.1016/j.compositesa.2005.07.006
27.
ChoiS, KimJ.Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers. Compos Part B. 2013;51(51):140–147. doi: 10.1016/j.compositesb.2013.03.002
28.
JiajunW, Xiao-SuY.Effects of interfacial thermal barrier resistance and particle shape and size on the thermal conductivity of AlN/PI composites. Compos Sci Technol. 2004;64(10-11):1623–1628. doi: 10.1016/j.compscitech.2003.11.007
29.
XieSH, ZhuBK, LiJB, Preparation and properties of polyimide/aluminum nitride composites. Polym Test. 2004;23(7):797–801. doi: 10.1016/j.polymertesting.2004.03.005
