Diffusion bonding is widely used for joining similar or dissimilar materials. It is necessary to develop a suitable approach to describe the variation of the bonding ratio throughout the bonding process. It helps to obtain the processing window based on limited experimental data. The analytical approach was developed to consider the effects of temperature, pressure and holding time on diffusion bonding ratio. The analytical approach of diffusion bonding of similar materials is further extended to that of dissimilar ones. Both approaches were verified by comparing the prediction and experiment data upon bonding ratio. The average absolute relative errors of the approaches of similar and dissimilar materials are 3.80% and 6.28%, respectively. Both approaches indicate good prediction accuracy.
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