In this paper selective deposition of copper on the steel substrate is described by the laser enhanced electroplating method from liquid phase i.e. aqueous copper sulphate solution. The present study involves (i) identification of suitable laser wavelength (i.e. frequency doubled Nd: YAG laser at 532 nm) with low absorption in the electrolyte, (ii) determination of threshold voltage for selective deposition with laser, (iii) experiments on laser-assisted selective copper electroplating and (iv) characterisation based on dimensions, surface topography, residual stresses and phases present. Thus formed deposits can be controlled by incident laser power density and build up growth increases with plating time.
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