Based on AgCuNiMn alloy, Ni/Cu/AgCuNiMn high-Ni solder was designed by in-situ synthesis. The WC-6Co/In718 joint was prepared by vacuum brazing at 950 °C for 10 min. The effect of metal foil on the filler metal filling ability, microstructure and mechanical properties of the joint was studied. The microstructure evolution and strengthening mechanism of the joint brazed with Ni/Cu/AgCuNiMn solder were analysed. The results showed that Ni element mainly plays a solution-strengthening role on the joint, and improve the interface bonding strength and the strength of Ag (s, s) distributed in the centre of the brazed joint, which increased the average tensile strength by 32.4% (from 426.5 to 564.7 MPa).
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