The stress relaxation behaviour of Cu–0.23Cr–0.08Ag alloy was studied at different deformations (10%, 20%, 30%). The high percentage of low ΣCSL (Coincidence Site Lattice) grain boundary could improve the stress relaxation resistance of the alloy. There are two main factors affecting the stress relaxation resistance: one is the pinning effect of Cr to movable dislocations; the other is the obstacle of twins to the movement of movable dislocations.
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