Commercial F500 SiC powder and 6061 Al powder were chosen to fabricate the 50 vol.-% SiCp/6061Al composites via pressureless sintering. Effects of pre-treatment of the SiC powder and sintering temperature on the microstructures and properties of the composites were studied. Densification mechanism and interfacial reaction of the composites were also investigated. The results show that the composites have a high sintering ability and a low interfacial reaction activity. The density, bending strength and thermal conductivity of the composites are all sensitive to the sintering temperature. The composites sintered at 680°C are nearly fully dense and have the following optimal properties: the relative density of 98.5%, the bending strength of 495 MPa, the TC of 153 W/(m K) and the coefficient of thermal expansion of 8.1 × 10−6/°C (50–100°C), which are superior to most of the SiCp/Al composites of the similar composition reported previously.
ZhuXM, YuJK, WangXY.Microstructure and properties of Al/Si/SiC composites for electronic packaging. Trans Nonferrous Met Soc China. 2010;22(7):1686–1692. doi: 10.1016/S1003-6326(11)61374-5
2.
ZhuMJ, LiS, ZhaoX, . Laser-weldable Sip–SiCp/Al hybrid composites with bilayer structure for electronic packaging. Trans Nonferrous Met Soc China. 2014;24(4):1032–1038. doi: 10.1016/S1003-6326(14)63158-7
3.
KimBG, DongSL, KimIJ.Anomalous reheating behavior of SiCp/Al composite with high volume fraction reinforcement. Met Mater Int. 2001;7(3):213–220. doi: 10.1007/BF03026978
4.
WuCML, HanGW.Thermal fatigue behaviour of SiCp/Al composite synthesized by metal infiltration. Compos Part A: Appl Sci Manuf. 2006;37(11):1858–1862. doi: 10.1016/j.compositesa.2006.01.001
5.
TengF, YuK, LuoJ, . Microstructures and properties of Al–50%SiC composites for electronic packaging applications. Trans Nonferrous Met Soc China. 2016;26(10):2647–2652. doi: 10.1016/S1003-6326(16)64358-3
6.
HaoSM, XieJP.Tensile properties and strengthening mechanisms of SiCp-reinforced aluminum matrix composites as a function of relative particle size ratio. J Mater Res. 2013;28(15):2047–2055. doi: 10.1557/jmr.2013.202
7.
GuiMC, KangSB, EuhK.Thermal conductivity of Al–SiCp composites by plasma spraying. Scr Mater. 2005;52(1):51–56. doi: 10.1016/j.scriptamat.2004.08.028
8.
MathewJ, JayakumarK, JosephMA, . Synthesis and characterization of A356-SiCp composite produced through vacuum hot pressing. Adv Manuf Proc. 2013;28(9):991–998.
9.
YanYW, GengL.Effects of particle size on the thermal expansion behavior of SiCp/Al composites. J Mater Sci. 2007;42(15):6433–6438. doi: 10.1007/s10853-006-1200-7
10.
ChuK, JiaCC, LiangXB, . Effect of sintering temperature on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering. Int J Min Metall Mater. 2010;17(2):234–240. doi: 10.1007/s12613-010-0220-0
11.
ParvinN, AssadifardR, SafarzadehP, . Preparation and mechanical properties of SiC-reinforced Al6061 composite by mechanical alloying. Mater Sci Eng A. 2008;492(1):134–140. doi: 10.1016/j.msea.2008.05.004
12.
WangRM, SurappaMK, TaoCH, . Microstructure and interface structure studies of SiCp-reinforced Al (6061) metal-matrix composites. Mater Sci Eng A. 1998;254(1):219–226. doi: 10.1016/S0921-5093(98)00686-8
13.
ZulfiaA, HandRJ.The production of Al-Mg alloy/SiC metal matrix composites by pressureless infiltration. J Mater Sci. 2002;37(5):955–961. doi: 10.1023/A:1014395730170
14.
RomeroJC, ArsenaultRJ.Anomalous penetration of Al into SiC. Acta Metall Mater. 1995;43(2):849–857. doi: 10.1016/0956-7151(94)00250-L
15.
KannikeswaranK, LinRY.Trace element effects on Al-SiC interfaces. J Min Met Mater Soc. 1987;39(9):17–19. doi: 10.1007/BF03257644
16.
RenSB, HeXB, QuXH, . Effect of Mg and Si in the aluminum on the thermo-mechanical properties of pressureless infiltrated SiCp/Al composites. Compos Sci Technol. 2007;67(10):2103–2113. doi: 10.1016/j.compscitech.2006.11.006
QuSG, LouHS, LiXQ.Influence of particle size distribution on properties of SiC particles reinforced aluminum matrix composites with high SiC particle content. J Compos Mater. 2016;50(8):1049–1058. doi: 10.1177/0021998315586864
19.
HasselmanDPH, DonaldsonKY, GeigerAL.Effect of reinforcement particle size on the thermal conductivity of a particulate-silicon carbide-reinforced aluminum matrix composite. J Am Ceram Soc. 1992;75(11):3137–3140. doi: 10.1111/j.1151-2916.1992.tb04400.x
20.
LeeHS, HongSH.Pressure infiltration casting process and thermophysical properties of high volume fraction SiCp/Al metal matrix composites. Mater Sci Technol. 2003;19(8):1057–1064. doi: 10.1179/026708303225004396
21.
GeigerAL, JacksonM.Low-expansion MMCs boost avionics. Adv Mater Proc. 1989;136(1):23–30.
22.
HuberH, DegischerHP, LefrancG, . Thermal expansion studies on aluminium-matrix composites with different reinforcement architecture of SiC particles. Comp Sci Technol. 2006;66(13):2206–2217. doi: 10.1016/j.compscitech.2005.12.012
