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Research article

First published 2014-4

A new hybrid bonding technique: Adhesive-soft soldered joints

N Kavak, E Altan

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 1998-2

A computational modelling framework to predict macroscopic phenomena in solder joint formation

D Wheeler, C Bailey, M Cross

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 1997-1

A study of the strength and shape of surface mount technology leadless chip solder joints

I. K. Hui, B Ralph

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2004-10

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

Hua Ye, Cemal Basaran, Douglas C. Hopkins

International Journal of Damage Mechanics

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Research article

First published 2022-10

Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

J. Ren, M. L. Huang

Science and Technology of Welding and Joining

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Research article

First published 2006-01

Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses

Hua Ye, Cemal Basaran, Douglas C. Hopkins

International Journal of Damage Mechanics

Open access

Research article

First published 2021

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Norliza Ismail, Azman Jalar, Atiqah Afdzaluddin [...]

Nanomaterials and Nanotechnology

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Research article

First published 2012-4

Proportional hazards model for reliability analysis of solder joints under various drop-impact and vibration conditions

M-Y You, F Liu, G Meng

Proceedings of the Institution of Mechanical Engineers,Part O: Journal of Risk and Reliability

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Research article

First published 2012-6

Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

K K Zhang, C Y Li, R F Qiu [...]

Materials Science and Technology

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Research article

First published 2017-10

A design of a new miniature device for solder joints’ mechanical properties evaluation

Quang-Bang Tao, Lahouari Benabou, Laurent Vivet [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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