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Research article

First published 2015-9

The application of pneumatic jigging in the recovery of metallic fraction from shredded printed wiring boards

Zheng Wang, Philip Hall, Nicholas J Miles [...]

Waste Management & Research: The Journal for a Sustainable Circular Economy

Free access

Research article

First published 1993-01

Thermo-Stress Analysis of a Plated-Through-Hole in a Composite Printed Wiring Board

J.M. Whitney, I.U. Haq, S.R. Soni

Journal of Thermoplastic Composite Materials

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Research article

First published 2019-6

Influence of non-metallic parts of waste printed circuit boards on the properties of plasticised polyvinyl chloride recycled from the waste wire

Rajesha K Das, Omdeo K Gohatre, Manoranjan Biswal [...]

Waste Management & Research: The Journal for a Sustainable Circular Economy

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Research article

First published 2004-4

Gold soldering in microelectronic products with tin–indium solder

A. T. Kosilov, G. L. Polner, I. U. Smurov [...]

Science and Technology of Welding and Joining

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Review article

First published 2000-05

Polymer-Matrix Composites for Microelectronics

D.D.L. Chung

Polymers and Polymer Composites

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Research article

First published 2019-9

Novel H-coil design with improved immunity to off-axis H components

Stan Zurek, Roman Rygał

International Journal of Applied Electromagnetics and Mechanics

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Research article

First published 2023-6

Investigation of electrical performances of textile conductive lines under different connector configurations and external influences

Lazar Milić, Dejan Movrin, Mitar Simić [...]

Textile Research Journal

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Research article

First published 2000-04

Accelerated Stress Testing and Health Monitoring of Laminated Circuit Card Assemblies Using Piezoelectric Actuators and Sensors

C. S. Sealing, A. Dasgupta

Journal of Reinforced Plastics and Composites

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Other

First published 2004-01

A Review of Current Flame Retardant Systems for Epoxy Resins

Edward D. Weil, Sergei Levchik

Journal of Fire Sciences

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Research article

First published 2008-9

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique

S. J. Hong, B-H. Park, D. S. Seo [...]

Surface Engineering

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