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1-6 of 6 results for minimum wafer thickness

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Research article

First published 2012-1

A study on the diamond grinding of ultra-thin silicon wafers

L Zhou, Y B Tian, H Huang [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2022-7

Anmol S Verma, Shankar Singh

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2013-11

Ganesh G Dongre, Cyrus Vesivkar, Ramesh Singh [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2000-03

Masahito Tagawa, Kumiko Yokota, Nobuo Ohmae [...]

High Performance Polymers

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Research article

First published 1995-6

Jun Shen, Andreas Mandelis, Andreas Othonos [...]

Applied Spectroscopy

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Research article

First published 2023

Prabhat Ranjan, Tribeni Roy, and Anuj Sharma

Journal of Micromanufacturing