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low temperature solder paste
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Select article: Experimental studies on application of silver paste in thermosonic flip-chip bonding
Open access
Research article
First published March, 2023
Experimental studies on application of silver paste in thermosonic flip-chip bonding
Hui Yang
,
Zhengbang Zhan
Journal of Low Frequency Noise,Vibration and Active Control
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Select article: Connecting surface-mounted electronic elements with amber strand metal-clad conductive fibers by reflow soldering
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Research article
First published September, 2023
Connecting surface-mounted electronic elements with amber strand metal-clad conductive fibers by reflow soldering
Abdella Ahmmed Simegnaw
,
Benny Malengier,
Melkie Getnet
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Textile Research Journal
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, Zhengbang Zhan, Benny Malengier, Melkie Getnet 
