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Research article

First published 2009-10

Comparison of Inelastic Behaviors of Lead-Free and Sn—Pb Solder Joints

Hsin-Chun Tsai, Wen-Ren Jong, Hsiu-Tao Chang

Journal of Reinforced Plastics and Composites

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Research article

First published 2013-12

Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Satyanarayan, K N Prabhu

Materials Science and Technology

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Research article

First published 2013-11

Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Wei Yao, Cemal Basaran

International Journal of Damage Mechanics

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Research article

First published 2018-5

Microstructure and reliability of Mo nanoparticle reinforced Sn–58Bi-based lead-free solder joints

Li Yang, Lu Zhu, Yaocheng Zhang [...]

Materials Science and Technology

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Research article

First published 2005-3

Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints

J.-W. Kim, J. Joo, D. J. Quesnel [...]

Materials Science and Technology

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Research article

First published 2007-08

The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

Hsin-Chun Tsai, Wen-Ren Jong

Journal of Reinforced Plastics and Composites

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Research article

First published 2017-10

A design of a new miniature device for solder joints’ mechanical properties evaluation

Quang-Bang Tao, Lahouari Benabou, Laurent Vivet [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2000-7

The mechanical properties of lead-containing and lead-free solders—meeting the environmental challenge

W J Plumbridge, C R Gagg

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 2014-3

Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Wei Yao, Cemal Basaran

International Journal of Damage Mechanics

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Research article

First published 2008-4

Using carbon nanotubes to enhance creep performance of lead free solder

S. M. L. Nai, J. Wei, M. Gupta

Materials Science and Technology

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