Sage Journals: Discover world-class research

Retricted access

Research article

First published 2004-1

Thermal stress induced by the adhesion topology of a semiconductor integrated circuit package

D C Lee, M G Kim, J I Lee

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

Retricted access

Research article

First published 2006-4

An investigation on the bending and curl-forming process of leads in integrated circuit packaging by the finite element method

Z-C Lin, C-C Chen

The Journal of Strain Analysis for Engineering Design

Retricted access

Research article

First published 1987-10

A Cad Package for Microwave Integrated Circuit Design

Finbarr J. McGrath, Patrick J. Murphy

International Journal of Electrical Engineering & Education

Retricted access

Research article

First published 1993-09

Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices

E. Suhir

Journal of Reinforced Plastics and Composites

Retricted access

Research article

First published 2003-3

Dynamic characteristics of stacked piezoelectric transducers of ultrasonic wire bonders used in integrated circuit packaging

C M Hu, N Guo, H Du [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

Retricted access

Research article

First published 1989-1

Student Full Custom Design

W. A. J. Waller, L. T. Walczowski, K. R. Dimond [...]

International Journal of Electrical Engineering & Education

Retricted access

Research article

First published 2013-9

Iodide based polyamide stabilisers as potential risk for corrosion in electronics

M. Leineweber, L. Müller

Corrosion Engineering,Science and Technology: The International Journal of Corrosion Processes and Corrosion Control

Retricted access

Research article

First published 1998-09

Stacking Technology for a Space Constrained Microsystem

M. Heschel, J. F. Kuhmann, S. Bouwstra [...]

Journal of Intelligent Material Systems and Structures

Retricted access

Research article

First published 2025

Integrated mobilities: Toward a critical hardware approach to mobile media

Kyle Stine, Rowan Wilken

Mobile Media & Communication

Open access

Review article

First published 2020-9

An introduction and review on innovative silicon implementations of implantable/scalp EEG chips for data acquisition,seizure/behavior detection,and brain stimulation

Weiwei Shi, Jinyong Zhang, Zhiguo Zhang [...]

Brain Science Advances

Search results