Sage Journals: Discover world-class research

Retricted access

Research article

First published 2017-2

Coupled effect of loading frequency and amplitude on the fatigue behavior of advanced sheet molding compound (A-SMC)

M Shirinbayan, J Fitoussi, F Meraghni [...]

Journal of Reinforced Plastics and Composites

Retricted access

Research article

First published 2001-11

Experimental Investigation of Thermal Fatigue-induced Strain in a Tool Steel Coated With Plasma-sprayed,Stabilised Zirconia

F. Turquier, V. Stanic, M. Ceretti [...]

Journal of Neutron Research

Open access

Research article

First published 2014

Thermal-Acoustic Fatigue of a Multilayer Thermal Protection System in Combined Extreme Environments

Liu Liu, Qiong Guo, Tiren He

Advances in Mechanical Engineering

Retricted access

Research article

First published 2005

Field and Theoretical Evaluation of Thermal Fatigue Cracking in Flexible Pavements

Imad L. Al-Qadi, Marwa M. Hassan, Mostafa A. Elseifi

Transportation Research Record: Journal of the Transportation Research Board

Retricted access

Research article

First published 1996-02

Prediction of Thermal Cycling Induced Matrix Cracking

Hugh L. Mcmanus, David E. Bowles, Stephen S. Tompkins

Journal of Reinforced Plastics and Composites

Retricted access

Research article

First published 2009-7

Effect of bulk die temperature on die cavity surface strains in thixoforming of steels

Y. Birol

Ironmaking & Steelmaking: Processes,Products and Applications

Retricted access

Research article

First published 2023-8

Characterization on fatigue behavior and damage mechanism of C/BMI composites experienced thermal cycling

Tiejun Gao, Bowen Gao, Yu Gao [...]

Journal of Composite Materials

Retricted access

Research article

First published 2005-5

Thermal cracking of multicomponent white cast iron

C. R. S. da Silva, M. Boccalini

Materials Science and Technology

Retricted access

Research article

First published 2004-05

Torsional Fatigue Characteristics of Aluminum–Composite Co-Cured Shafts with Axial Compressive Preload

Dai Gil Lee, Jong Woon Kim, Hui Yun Hwang

Journal of Composite Materials

Retricted access

Research article

First published 2004-1

Thermal stress induced by the adhesion topology of a semiconductor integrated circuit package

D C Lee, M G Kim, J I Lee

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

Search results