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1-5 of 5 results for flip chip assemblies

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Research article

First published 2018-10

Scaling effect on Ag 3 Sn growth behaviours in micro-joints for flip chip assemblies

Ye Tian, Ning Ren, Xiaoxia Jian [...]

Science and Technology of Welding and Joining

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Research article

First published 2005-12

Three-dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-chip Packages under Temperature Cycling Conditions

G. H. Wu, T. C. Tsein, S. H. Ju

Journal of Reinforced Plastics and Composites

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Research article

First published 2001-7

Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages

Raghuram Pucha, James Pyland, Suresh K. Sitaraman

International Journal of Damage Mechanics

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Research article

First published 2000-6

“Microflex”—A New Assembling Technique for Interconnects

Thomas Stieglitz, Hansjoerg Beutel, J. -Uwe Meyer

Journal of Intelligent Material Systems and Structures

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Research article

First published 1994-11

Solidification and microstructure of eutectic Pb–Sn microsolder bonds

N. R. Green, J. A. Charles, G. C. Smith

Materials Science and Technology