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chip–package interconnection
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Select article: Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview
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Research article
First published May, 2020
Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview
Madhav Datta
Journal of Micromanufacturing
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Select article: Stacking Technology for a Space Constrained Microsystem
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Research article
First published September, 1998
Stacking Technology for a Space Constrained Microsystem
M. Heschel,
J. F. Kuhmann,
S. Bouwstra
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Journal of Intelligent Material Systems and Structures
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Select article: Making Circuits More than Once: The Manufacturing Challenges of Electronics Intensive Products
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Research article
First published May, 1993
Making Circuits More than Once: The Manufacturing Challenges of Electronics Intensive Products
D J Williams,
P P Conway,
D C Whalley
Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture
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