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1-2 of 2 results for back grinding of wafer with outer rim

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Research article

First published 2021-10

The effect of the chuck shape on the wafer topography in back grinding of wafer with outer rim

Xianglong Zhu, Weihua Yao, Xiaoguang Guo [...]

Advances in Mechanical Engineering

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Research article

First published 2020-8

Xianglong Zhu, Yu Li, Zhigang Dong [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science