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Select article: Microstructure and mechanical properties of Cu/Sn-In/Cu joints obtained by ultrasonic-assisted transient liquid phase bonding in air

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Research article

First published October, 2020

Microstructure and mechanical properties of Cu/Sn-In/Cu joints obtained by ultrasonic-assisted transient liquid phase bonding in air

Yan Bi, Yong Nie, Qian Wang [...]

Advances in Mechanical Engineering

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