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1-5 of 5 results for Sn–3.0Ag–0.5Cu

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Research article

First published 2022-10

Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

J. Ren, M. L. Huang

Science and Technology of Welding and Joining

Open access

Research article

First published 2021

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Norliza Ismail, Azman Jalar, Atiqah Afdzaluddin [...]

Nanomaterials and Nanotechnology

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Research article

First published 2018-10

Scaling effect on Ag 3 Sn growth behaviours in micro-joints for flip chip assemblies

Ye Tian, Ning Ren, Xiaoxia Jian [...]

Science and Technology of Welding and Joining

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Research article

First published 2023-12

Void-free interface between in and high-impurity Cu joint

Jia-Yi Lee, Yu-An Shen, Chih-Ming Chen

Science and Technology of Welding and Joining

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Research article

First published 2007-7

Factors influencing current density distribution and current crowding in flip chip solder joints

C. Yu, H. Lu, R. Z. Fan [...]

Science and Technology of Welding and Joining