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First published 2008-6

Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

F. Q. Li, C. Q. Wang, Y. H. Tian

Materials Science and Technology

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Research article

First published 1997-12

Metal droplet deposition: Review of innovative joining technique

J. J. C. Buelens

Science and Technology of Welding and Joining

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Research article

First published 2022-5

Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions

K. Georgy, Sanjay Tikale, K. Narayan Prabhu

Materials Science and Technology

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Research article

First published 2002-12

Thermo–fluid mechanisms controlling droplet based materials processes

S. Q. Armster, J.-P. Delplanque, M. Rein [...]

International Materials Reviews

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Research article

First published 2025-7

Non-isothermal spreading and solidification of a molten droplet on solid substrates: An experimental and machine learning-based study

Parnian Hemmati, Santoshi Subramanian, Peiwen Yan [...]

Journal of Plastic Film & Sheeting

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Research article

First published 1999-8

Evaluation of thin film coatings for erosive–corrosive wear prevention in die casting dies

S. Gopal, A. Lakare, R. Shivpuri

Surface Engineering

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Research article

First published 2013-9

Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

V. Verdingovas, M. S. Jellesen, R. Ambat

Corrosion Engineering,Science and Technology: The International Journal of Corrosion Processes and Corrosion Control

Search results

Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

Metal droplet deposition: Review of innovative joining technique

Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions

Thermo–fluid mechanisms controlling droplet based materials processes

Non-isothermal spreading and solidification of a molten droplet on solid substrates: An experimental and machine learning-based study

Evaluation of thin film coatings for erosive–corrosive wear prevention in die casting dies

Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components