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1-3 of 3 results for SN-AG-NI COMPOSITE SOLDER

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Select article: Effects of in situ nickel particle addition on the microstructure and microhardness of Sn–Ag solder

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Research article

First published 2005-6

Effects of in situ nickel particle addition on the microstructure and microhardness of Sn–Ag solder

H. T. Lee, Y. H. Lee

Science and Technology of Welding and Joining

Select article: Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints

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Research article

First published 2005-3

Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints

J.-W. Kim, J. Joo, D. J. Quesnel [...]

Materials Science and Technology

Select article: Formation of intermetallic compounds with Sn–Zn–Al solder on copper and electroless nickel–immersion gold substrates

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Research article

First published 2007-10

Formation of intermetallic compounds with Sn–Zn–Al solder on copper and electroless nickel–immersion gold substrates

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

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