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Articles (91)

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1-10 of 91 results for SN-AG-CU

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Select article: Experiments on the aging of Sn–Ag–Cu solder alloys

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Research article

First published 2005-6

Experiments on the aging of Sn–Ag–Cu solder alloys

L. Snugovsky, D. D. Perovic, J. W. Rutter

Powder Metallurgy

Select article: Experiments on the aging of Sn–Ag–Cu solder alloys

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Research article

First published 2004-8

Experiments on the aging of Sn–Ag–Cu solder alloys

L. Snugovsky, D.D. Perovic, J.W. Rutter

Materials Science and Technology

Select article: Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

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Research article

First published 2005-1

Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Solidification of ternary eutectic and near eutectic alloys in the Ag – Cu – Sn system

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Research article

First published 2004-11

Solidification of ternary eutectic and near eutectic alloys in the Ag – Cu – Sn system

L. Snugovsky, D. D. Perovic, J. W. Rutter

Materials Science and Technology

Select article: Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints

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Research article

First published 2018-10

Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints

Tomasz Gancarz, Janusz Pstrus, Katarzyna Berent

Science and Technology of Welding and Joining

Select article: Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder

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Research article

First published 2005-1

Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Effect of tin on melting temperature and microstructure of Ag–Cu–Zn–Sn filler metals

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Research article

First published 2005-11

Effect of tin on melting temperature and microstructure of Ag–Cu–Zn–Sn filler metals

M. G. Li, D. Q. Sun, X. M. Qiu [...]

Materials Science and Technology

Select article: Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

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Research article

First published 2009-12

Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

J.-W. Yoon, S.-B. Jung

Materials Science and Technology

Select article: Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint

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Research article

First published 2011-11

Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint

Z Zeng, X B Li, L Li [...]

Materials Science and Technology

Select article: Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: A comparative study

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Research article

First published 2010-5

Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: A comparative study

M. Ghosh, M. K. Gunjan, S. K. Das [...]

Materials Science and Technology

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