You are on the new improved site. You can view the old site in view-only mode here until June 27, 2026

Filter Results

Search all journals

Enter search terms…

Advanced search

/

About

About Sage
About Sage Journals
Privacy Policy
Terms of Use
Contact Us
Help

Information for

Authors
Editors
Librarians
Researchers
Reviewers
Frequently asked questions

Copyright © 2026 by Sage Publications.京ICP备09090397号-11

Search results

Search results page

Articles (11)

Journals (0)

1-10 of 11 results for PB FREE SN-CU SOLDER

Sort by:

Relevance

Select all

Select all

Sort by:

Relevance

Select article: Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder

Retricted access

Research article

First published 2005-1

Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Microstructures formed from mixed solders on copper substrate

Retricted access

Research article

First published 2009-12

Microstructures formed from mixed solders on copper substrate

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Experiments on the aging of Sn–Ag–Cu solder alloys

Retricted access

Research article

First published 2005-6

Experiments on the aging of Sn–Ag–Cu solder alloys

L. Snugovsky, D. D. Perovic, J. W. Rutter

Powder Metallurgy

Select article: Experiments on the aging of Sn–Ag–Cu solder alloys

Retricted access

Research article

First published 2004-8

Experiments on the aging of Sn–Ag–Cu solder alloys

L. Snugovsky, D.D. Perovic, J.W. Rutter

Materials Science and Technology

Select article: Thermomechanical behaviour of environmentally benign Pb-free solders

Retricted access

Research article

First published 2009-11

Thermomechanical behaviour of environmentally benign Pb-free solders

N Chawla

International Materials Reviews

Select article: Reliability of Pb-free solders for harsh environment electronic assemblies

Retricted access

Review article

First published 2012-3

Reliability of Pb-free solders for harsh environment electronic assemblies

S Godard Desmarest

Materials Science and Technology

Select article: Metallurgy of low temperature Pb-free solders for electronic assembly

Retricted access

Research article

First published 1995-1

Metallurgy of low temperature Pb-free solders for electronic assembly

J. Glazer

International Materials Reviews

Select article: ‘Spalling’ of SAC Pb free solders when used with nickel substrates

Retricted access

Research article

First published 2009-10

‘Spalling’ of SAC Pb free solders when used with nickel substrates

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

Retricted access

Research article

First published 2005-1

Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

Retricted access

Research article

First published 2007-08

The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

Hsin-Chun Tsai, Wen-Ren Jong

Journal of Reinforced Plastics and Composites

1
2
10 / page

Article type

Publication date

Subjects

Access