Sage Journals: Discover world-class research

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Research article

First published 2004-2

Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor

Naoki Muraki, Nobuhiro Matoba, Takayuki Hirano [...]

Applied Spectroscopy

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Research article

First published 2019-6

Lightweight alternatives to glass fiber/epoxy sheet molding compound composites: A feasibility study

Amir Asadi, Ferdinand Baaij, Robert J Moon [...]

Journal of Composite Materials

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Research article

First published 1993-05

On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound

L.S. Turng, V.W. Wang

Journal of Reinforced Plastics and Composites

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Research article

First published 2009-10

A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

M. Khalil Abdullah, M.Z. Abdullah, M.A. Mujeebu [...]

Journal of Reinforced Plastics and Composites

Free access

Research article

First published 2018-1

Reliability Design and Optimization Process on through Mold via using Ultrafast Laser

Hsiang-Chen Hsu, Shih-Jeh Wu, Wen-Fei Lin [...]

Polymers and Polymer Composites

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Research article

First published 2004-11

Effect of Post-mold Curing on Package Reliability

Manfred Mengel, Joachim Mahler, Wolfgang Schober

Journal of Reinforced Plastics and Composites

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Research article

First published 2018-10

Compression molding of algae fiber and epoxy composites: Modeling of elastic modulus

Alejandra Constante, Selvum Pillay

Journal of Reinforced Plastics and Composites

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Research article

First published 2012-6

Recyclability and reutilization of carbon fiber fabric/epoxy composites

Paolo Feraboli, Hirohide Kawakami, Bonnie Wade [...]

Journal of Composite Materials

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