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Research article

First published 2025

A multi-state reliability assessment method of redundant components in subsea electronic control systems based on competing failure process

Xuewei Shi, Zengkai Liu, Baoping Cai [...]

Proceedings of the Institution of Mechanical Engineers,Part O: Journal of Risk and Reliability

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Research article

First published 2018-8

Double wavelength combined electronic speckle pattern interferometry–moiré system for full-field strain analysis on electronic components

Caterina Casavola, Giovanni Pappalettera

The Journal of Strain Analysis for Engineering Design

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Research article

First published 2014-8

Effects of component placement on solder joint through-life reliability

Ryan SH Yang, Derek R Braden, Guang-Ming Zhang [...]

Proceedings of the Institution of Mechanical Engineers,Part O: Journal of Risk and Reliability

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Research article

First published 1984-04

Factors affecting the reliability of microelectronics in severe offshore environments

G. Buchanan, H.W. Whittington

Transactions of the Institute of Measurement and Control

Open access

Research article

First published 2020-5

Simulation analysis of heat transfer performance of heat sink with reduced material design

Ya-Chu Chang

Advances in Mechanical Engineering

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Other

First published 2011-8

Electronic textile resistor design and fabric resistivity characterization

Pam Petersen, Richard Helmer, Margaret Pate [...]

Textile Research Journal

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Research article

First published 2023-9

Connecting surface-mounted electronic elements with amber strand metal-clad conductive fibers by reflow soldering

Abdella Ahmmed Simegnaw, Benny Malengier, Melkie Getnet [...]

Textile Research Journal

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Research article

First published 2017-5

A particle swarm optimization approach in printed circuit board thermal design

Alex Alexandridis, Evangelos Paizis, Eva Chondrodima [...]

Integrated Computer-Aided Engineering

Free access

Research article

First published 1999-8

Reliability assessment of a digital electronic board assembly using the physics-of-failure approach: A case study

C N Oguibe, D J Williams

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 1998-2

Personal computer aided design tool for developing TTC communication equipments with cheap components from the electronic consumers market

Kevin Kyeong‐il Choi, Jean‐Claude Llorens, Gérard Maral

Space Communications

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