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Research article

First published 2012-11

Electrodeposition of copper coating on AZ31 magnesium alloy

P Zhu, L Y Wang, Y Chen [...]

Surface Engineering

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Research article

First published 2024-3

Superhydrophobic modified electrodeposited copper surface for fog harvesting

Sanaz Nasrollahikateb Elizee, Fatemeh Asjadi, Seyed Ahmad Lajevardi

Surface Engineering

Free access

Research article

First published 2003-6

Optimization of trench filling during copper electrodeposition by additives and pulse plating

M Georgiadou, D Veyret

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2015-6

Electrodeposition and characterisation of copper deposits from non-cyanide electrolytes

R. Sekar, K. K. Jagadesh, G. N. K. Ramesh Bapu

Surface Engineering

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Research article

First published 2009-6

Effect of solution impurities on morphology and composition of copper electrodeposits obtained in membrane based cell

L. Cifuentes, M. Grágeda, J. M. Casas [...]

Materials Science and Technology

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Research article

First published 2016-3

Effects of process parameters on the adhesive strength of copper electrodeposits in a bench-scale electrowinning cell

A. Murray, H. Khakbaz, A. Pranowo [...]

Mineral Processing and Extractive Metallurgy: Transactions of the Institutions of Mining and Metallurgy

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Research article

First published 2025-1

Electrodeposition-anodising for preparing corrosion-resistant copper coatings for Gd metal

Lunye Sun, Saibei Ma, Haojie Wu [...]

Surface Engineering

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Research article

First published 1994-1

Electrodeposition and corrosion behaviour of copper-nickel alloys

L. Bonou, Y. Massiani, J. Crousier

Corrosion Engineering,Science and Technology: The International Journal of Corrosion Processes and Corrosion Control

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Research article

First published 2018-6

Substrate effect on electrodeposited copper morphology and crystal shapes

Swastika Banthia, Srijan Sengupta, Manila Mallik [...]

Surface Engineering

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Research article

First published 2002-4

Electrodeposition of Copper as a Route for Tantalum Drawing

A. Robin, K. Alves de Souza, J. Luiz Rosa [...]

Surface Engineering

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