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Research article

First published 2004-9

Hygrothermal stress analysis of a plastic ball grid array package during solder reflow

K-C Chang, M-K Yeh, K-N Chiang

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2007-01

Thermal Study of Enhanced Plastic Ball Grid Array Package with Flat Heat Spreader

T. P. Huang, G. H. Wu

Journal of Reinforced Plastics and Composites

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Research article

First published 2011-12

Optimal design of thin-profile fine-pitch ball grid array package under drop impact test

R S Chen, H E Cheng, R W Wu [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2005-4

Thermal analysis and optimization for a ball grid array package

C-I Ho, T-C Hung, C-I Hung

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2011-8

Benefits from condition monitoring techniques: a case study on maintenance scheduling of ball grid array solder joints

M-Y You, F Liu, G Meng

Proceedings of the Institution of Mechanical Engineers,Part E: Journal of Process Mechanical Engineering

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Research article

First published 2006-1

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global–local finite element model

K-C Chang, K-N Chiang

The Journal of Strain Analysis for Engineering Design

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Research article

First published 2004-2

Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor

Naoki Muraki, Nobuhiro Matoba, Takayuki Hirano [...]

Applied Spectroscopy

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Research article

First published 2025-2

Fatigue life prediction of BGA solder joint of several alloy compositions under an isothermal harmonic vibration

Jihen Rebai, Abdelkhalak El Hami, Sinda Ghenam [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2005-1

Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

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Research article

First published 2002-01

Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronics Packaging

Cemal Basaran, Hong Tang

International Journal of Damage Mechanics

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