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1-4 of 4 results for BGA package

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Research article

First published 2005-4

Thermal analysis and optimization for a ball grid array package

C-I Ho, T-C Hung, C-I Hung

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2001-04

Cemal Basaran, Alexander Cartwright, Ying Zhao

International Journal of Damage Mechanics

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Research article

First published 2001-7

Hong Tang, Cemal Basaran

International Journal of Damage Mechanics

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Research article

First published 2002-01

Cemal Basaran, Hong Tang

International Journal of Damage Mechanics