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Articles (35)

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1-10 of 35 results for ACTIVE SOLDERING

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Select article: Challenging gold based filler metals for uses in medicine

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Research article

First published 2009-12

Challenging gold based filler metals for uses in medicine

K. Bobzin, E. Lugscheider, F. Ernst [...]

Materials Science and Technology

Select article: Activation energies of intermetallic compound growth at interface between Sn–5Bi–3.5Ag solder and Cu substrate

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Research article

First published 2003-8

Activation energies of intermetallic compound growth at interface between Sn–5Bi–3.5Ag solder and Cu substrate

J.-W. Yoon, C.-B. Lee, S.-B. Jung

Materials Science and Technology

Select article: Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

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Research article

First published 2014-4

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

A. F. Abd El-Rehim, H. Y. Zahran

Materials Science and Technology

Select article: Impression creep of Sn–40Pb–2·5Sb peritectic solder alloy

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Research article

First published 2005-7

Impression creep of Sn–40Pb–2·5Sb peritectic solder alloy

A. Rezaee-Bazzaz, R. Mahmudi

Materials Science and Technology

Select article: Kinetics of intermetallic compound layer growth and interfacial reactions between Sn–8Zn–5In solder and bare copper substrate

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Research article

First published 2005-3

Kinetics of intermetallic compound layer growth and interfacial reactions between Sn–8Zn–5In solder and bare copper substrate

D.-G. Kim, H.-S. Jung, S.-B. Jung

Materials Science and Technology

Select article: Soldering technology — decade of developments

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Research article

First published 1984-1

Soldering technology — decade of developments

C. J. Thwaites

International Materials Reviews

Select article: Using carbon nanotubes to enhance creep performance of lead free solder

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Research article

First published 2008-4

Using carbon nanotubes to enhance creep performance of lead free solder

S. M. L. Nai, J. Wei, M. Gupta

Materials Science and Technology

Select article: Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

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Research article

First published 2012-6

Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

K K Zhang, C Y Li, R F Qiu [...]

Materials Science and Technology

Select article: Reaction processes between silver or zinc doped Pb–Sn solder and gold

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Research article

First published 1992-10

Reaction processes between silver or zinc doped Pb–Sn solder and gold

C. R Hall, EI.-B. Hannech

Materials Science and Technology

Select article: Dye-Enhanced Protein Solders and Patches in Laser-Assisted Tissue Welding

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Research article

First published 1997-10

Dye-Enhanced Protein Solders and Patches in Laser-Assisted Tissue Welding

Ward Small, Nicholas J. Heredia, Duncan J. Maitland [...]

Photobiomodulation,Photomedicine,and Laser Surgery

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