Abstract
An electrical field model governing copper electrodeposition process on printed circuit board (PCB) aided by the presence an ultrasonic field is presented in this paper. The problems associated with plating of copper and the current distribution into through-holes and advantages gained by ultrasonic intensification of the electrodeposition process are well known and are the subject of many investigations. Our experiments indicate that a copper layer in a through-hole grows faster than on their flat surface of PCB in this process.
On the basis of measurements, a numerical (FEM) model has been proposed. The inverse problem has been formulated for coupled (a boundary conditions) fields making it possible to control the current density and the layer thickness. An artificial neural network is applied to solve this problem.
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