Abstract
Cross-wound eddy current sensors have been used for years in the non-destructive testing industry for surface detection of cracks on steel components. The conventional sensor, which is a three dimensional transmit-receive structure comprising two orthogonal coils, can't be directly translated to a flat winding suitable for printed circuit board (PCB) manufacturing. This paper describes a method that makes it possible, through the use of finite element modeling (FEM), to reproduce the cross wound sensor response on a flexible printed circuit board. As a second step, an innovative compact PCB made cross-wound eddy current array (ECA) structure is presented and demonstrated experimentally.
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