The determination of several percent of Au, Ag, and Cu in various Sn/Pb solder compositions used in the manufacture of microelectronic circuits is described. Details of the preparation of standards and x-ray procedure are given. The Au calibration curve can be prepared from any Sn/Pb composition. The Ag and Cu calibration curves must be prepared for each solder composition.
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References
1.
MankoH. H., Solders and Soldering (McGraw-Hill Book Company, Inc., New York, 1964).
LiebhafskyH. A.PfeifferH. G.WinslowE. H.ZemanyP. D., X-Ray Absorption and Emission in Analytical Chemistry (John Wiley & Sons, Inc., New York, 1960) p. 278.
