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Abstract

A new method linking experimental and theoretical approaches is proposed to precisely analyse the failure of liquid crystal display (LCD) panels under mechanical drop. Generally, the thickness of a glass plate for LCD panel is less than 0.7 mm, and thus requires sufficient strength to withstand mechanical shock. In the present work, the fracture toughness (K_IC ) of panel glass obtained experimentally is compared with the stress-intensity factor (K_I ) calculated using the maximum stress at weak points via a finite-element drop simulation in order to evaluate crack growth on the panel. It is demonstrated that this approach is simple but effective to determine the specification of components at the design level, including the roughness of glass panel edges. Furthermore, from a dynamic simulation, important information related to the shockproof design of an LCD panel is gathered.

Keywords

liquid crystal display panel drop test crack growth fracture toughness stress-intensity factor

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References

Jang

Lim

Technology development and production of flat panel displays in Korea. Proc. IEEE, 2002, 90(4), 501–513.

Watanabe

Tsurusawa

Shiratori

Kakino

Fujiwara

The examination of the drop impact test method. In Inter Society Conference on Thermal Phenomena, 2004, pp. 336–342.

Lim

C. T.

Low

Y. J.

Drop impact testing of portable electronic products. In Proceedings of the 52nd ECTC Conference, 2002, pp. 1270–1274.

JEDEC Standard JESD22-B104-B. Mechanical shock, 2001.

Goyal

Upasani

Patel

D. M.

Improving impact tolerance of portable electronic products: Case study of cellular phones. Expl Mech., 1999, 39(1), 43–52.

Goyal

Papadopoulos

J. M.

Sullivan

P. A.

The dynamics of clattering I: Equation of motions and examples. Trans. ASME J. Dyn. Syst. Meas. Control, 1998, 120(1), 94–102.

Zhu

L. P.

Marcinkiewicz

Drop impact reliability analysis of CSP packages at board and product levels through modeling approaches. IEEE Trans. Compon. Packag. Technol., 2005, 28(3), 449–456.

Zhu

L. P.

Submodeling technique for BGA reliability analysis of CSP packaging subjected to an impact loading. In Proceedings of 2001 International Intersociety Electronic and Photonic Packaging Conference and Exhibition: InterPACK01, Kauai, Hawaii, July 2001, pp. 1401–1409 (American Society of Mechanical Engineers).

Anderson

T. L.

Fracture mechanics: fundamentals and applications, 1995 (CRC Press, Boston, MA).

10.

Zeng

Breder

Rowcliffe

D. J.

The Hertizan stress field and formation of cone cracks-I. Theoretical approach. Acta Metall. Mater., 1992, 40(10), 2595–2600.

11.

Evans

A. G.

Fracture toughness: The role of indentation techniques. In Fracture mechanics applied to brittle materials 1979, ASTM STP 678, pp. 112–135 (American Society for Testing and Materials, Pennsylvania).

12.

Niihara

Morena

Hasselman

D. P. H.

Indentation fracture toughness of brittle materials for Palmqvist cracks. In Fracture mechanisms of ceramics (Ed. Bradt

R. C.

et al.), vol. 5, 1983, pp. 97–105 (Plenum Press, New York).

13.

Niihara

Morena

Hasselman

D. P. H.

Evaluation of K_IC of brittle solids by the indentation method with low crack-to-indent ratios. J. Mater. Sci. Lett., 1982, 1, 13–16.

14.

Shetty

D. K.

Wright

I. G.

Mincer

P. N.

Clauer

A. H.

Indentation fracture of WC-Co ceramics. J. Mater. Sci. Lett., 1985, 20, 1872–1882.

15.

Anstis

G. R.

Chantikul

Lawn

B. R.

Marshall

D. B.

A critical evaluation of indentation techniques for measuring fracture of toughness: I. Direct crack measurement. J. Am. Ceram. Soc., 1981, 64(9), 533–538.

16.

Chantikul

Anstis

G. R.

Lawn

B. R.

Marshall

D. B.

A critical evaluation of indentation techniques for measuring fracture toughness: Ii. Strength method. J. Am. Ceram. Soc., 1981, 64(9), 539–543.

17.

ASTM E399. Standard test method for plane-strain fracture toughness of metallic materials, 1997 (American Society for Testing and Materials, Pennsylvania).

18.

ASTM E384. Standard test method for microindentation hardness of materials, 1999 (American Society for Testing and Materials, Pennsylvania).

19.

Wayne

Applied life data analysis, 1982 (John Wiley & Sons Inc., New York).

20.

Evans

A. G.

Jone

R. L.

Evaluation of a fundamental approach for the statistical analysis of fracture. J. Am. Ceram. Soc., 1978, 61, 156–160.

21.

Lewis

J. V.

Rawson

Comparison of measurements of the strength of flat glass by plate bending and Hertz fracture methods. Glass Technol., 1976, 17, 128–135.

22.

Pam-Crash user's manual, 2001 (ESI Software Inc., Paris, France).

23.

Rice

J. R.

A path independent integral and approximation analysis of strain concentration by notches and cracks. Trans. ASME J. Appl. Mech., 1968, 35, 379–386.

24.

Murakami

Stress intensity factors handbook, 1987 (Pergamon Press, New York).

Investigation of the failure of a liquid crystal display panel under mechanical shock

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