Abstract
Abstract
A finite element model has been developed to determine the temperature distribution generated during a high power diode laser (HPDL) tile grout sealing process. Because of the complexity of the process, which involves five different materials in a complicated geometrical arrangement, finite element (FE) numerical simulation using ADINA rather than an analytical system has been used to model the temperature profile. The analysis has involved simulation of the three-dimensional transient temperature field produced by a laser beam with constant power scanning over the glazed enamel surface at constant speeds. Latent heat effects due to melting and solidification of the glazed enamel have been taken into account in the FE model, thereby facilitating a more realistic thermal analysis. Experimental validation of the FE predicted temperature profile has also been presented. The results show that both the FE predicted temperatures and those determined experimentally are in close agreement with each other. The effect of varying process parameters on temperature profiles is discussed to facilitate prediction of optimized process parameters.