A novel method of forming vias and embedded resistors in a double-sided electronic circuit substrate is proposed. The structures are formed by removing conductive material from a target by laser ablation and depositing it into a hole previously drilled in the substrate. The target is composed of a matrix material, which is readily ablated, supporting conductive particles that are ejected along with the matrix material to be re-deposited on the sides of the hole. The nature of the conductive particles determines whether a via or a resistor is formed.
RamseyB. J.EvansP. S. A.HarrisonD.A novel circuit fabrication technique using offset lithography. J. Electronic Mf., 1997, 7(1), 63–67.
3.
PiqueD. B.ChriseyR. C. Y.AuyeungJ.Fitz-GeraldH. D.WuR. A.McGillS.LakeouP. K.WuV. N.DuignanM.A novel laser transfer process for direct writing of electronic and sensor materials. In Conference on Laser Ablation (COLA 1999), Goettingen, Germany, July 1999.
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