This paper confirms results for plane thermoelastic problems obtained by a mechanical analogue procedure. The temperature distribution is caused by heating and cooling. The distributions of thermal stress obtained for this temperature field are compared with earlier results obtained by mechanical analogue.
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References
1.
SumiS.MatsumotoE.SekiyaT.‘Mechanical analog procedure for solution of plane thermoelastic problem’, Proc. 14th Jap. Natl Congr. appl. Mech.1964, 9.
2.
SumiS.MatsumotoE.SekiyaT.‘Analysis of unsteady thermal stress in hollow circular region by mechanical analogy’, Proc. 15th Jap. Natl Congr. appl. Mech.1965, 21.
3.
SekiyaT.SumiS.OkamotoM.AndohK.‘Analysis of plane thermoelastic problem in symmetrical region under asymmetrical temperature distribution by mechanical analog procedure’, Proc. 16th Jap. Natl Congr. appl. Mech.1966, 96.
4.
MatsumotoE.SekiyaT.Mechanical analogue procedure for olution of two-dimensional thermoelastic problems in multiply-connected regions Preprints of 2nd Internat. Conf. Structural Mechanics in Reactor Technology, Berlin 1973, L2/4.
5.
MatsumotoE.SekiyaT.Steady-state thermal stress of some multiply-connected regions by mechanical analogy using photoelasticity Joint J.S.M.E.-A.S.M.E. appl. Mechanics Western Conf., 75-AM J.S.M.E. A-5, 1975, 27.
6.
SouthwellR. V.Relaxation methods in theoretical physics Vol. II, 1956 (Oxford University Press).
7.
MindlinR. D.‘The analogy between multiply-connected slices and slabs’, Quart. appl. Math.1946IV (3), 279.
8.
SumiS.OgiwaraY.‘Analog studies of temperature and thermal stress in ingot moulds’, Bull. Univ. Osaka Pref.1967 A 16 (1), 39.
9.
SekiyaT.TakeutiY.‘Approximate solutions of thermal stress problems in plane elasticity’, Proc. 8th Jap. Natl Congr. appl. Mech.1958, 119.
