Abstract
To decrease the completion time during transient liquid phase (TLP) bonding, an Fe basedfiller metal (1M 7), comprising MA 956 base metal containing 7%Si and l%B (wt-%), was developed to join MA 956 base material. Transient liquid phase bonded joints free of microvoids and bondline intermetallic phases were obtained using a bonding temperature of 1563 K, a holding time of 2·16 ks, and an applied pressure of 7·0 MN m−2. The bondline region in the TLP bonded MA 956 base metal had a bamboolike microstructure which was considered to be peculiar to bonded oxide dispersion strengthened alloys. For this reason, the growth mechanism of the solid phase during isothermal solidification was evaluated. During tensile testing at 923 K, the joints TLP bonded at 1563 K for 2·16 ks fractured in the base metal zone and consequently the mechanical properties of the joint region and the base metal were similar. The creep rupture properties of the joint regions were close to the base metal properties in the transverse direction.
MST/2042
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