Abstract
A model for intergranular crack growth is developed in which atoms are deposited preferentially in a zone ahead of the crack tip. The crack remains sharp provided the length of the diffusive plating zone is much larger than the crack width. The crack velocity depends on a high power of the applied stress. Instabilities in the crack face which develop into finger-like cavity growth are stabilized when surface diffusion exceeds grain boundary diffusion. The crack growth mechanism is compared with observations in a stainless steel. It is concluded that diffusive crack growth may be rate-controlling in this material at crack growth rates below 10−12 m s−1 at 750°C, provided diffusive processes are not inhibited.
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