Abstract
In this review the protection of metals using coatings produced by chemical vapour deposition (CVD) is discussed, and the general principles and techniques of the various unified CVD processes are examined. Some aspects of fundamental studies associated with the deposition process are reviewed. The adhesion of coatings is discussed in detail, with the emphasis on the coating/substrate system and the factors which affect the adhesion of coatings. A survey is presented of the available or developed CVD coating systems which are likely to be relevant to protective coatings for metals. This is followed by a review of the applications of some CVD coatings for a variety of operating environments where, for example, protection is required against wear, erosion, corrosion, and high-temperature oxidation. The unique characteristics of CVD are discussed and its advantages and disadvantages are then considered in the light of these unique characteristics. Finally, an assessment is made of the present situation and future possibilities in the development and application of CVD protective coatings.
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References
1.
'Science and technology of surface coating',
(eds.
Chapman
B. N.
Anderson
J. C.
); 1974 , London , New York, Academic Press .
2.
'Vapour deposition',
(eds.
Powell
C. F.
et al.); 1966 , New York , Wiley .
3.
Schäfer
H.
: 'Chemical transport reactions'; 1964 , New York , Academic Press .
4.
'Proceedings of the conference on chemical vapour deposition of refractory metals, alloys and compounds',
(ed.
Schaff-hauser
A.C.
); 1967 , Hinsdale , Ill., American Nuclear Society .
5.
'Proceedings of the second international conference on chemical vapour deposition',
(eds.
Blocher
J. M.
Jr
Withers
J. C.
); 1970 , New York , Electrochemical Society .
6.
'Proceedings of the third international conference on chemical vapour deposition',
(ed.
Glaski
F. A.
); 1972 , Hinsdale , Ill., American Nuclear Society .
7.
'Proceedings of the fourth international conference on chemical vapour deposition',
(eds.
Wakefield
G. F.
Blocher
J. M.
Jr
); 1973 , Princeton , Electrochemical Society .
8.
'Proceedings of the fifth international conference on chemical vapour deposition',
(eds.
Blocher
J. M.
Jr
et al.); 1975 , Princeton , Electrochemical Society .
9.
Krier
C. A.
: Ref. 2, p. 512; C. A. Krier and J. M. Gunderson: Met. Eng. Q. , 1965 , 5 , (5) , 1 .
10.
Blocher
J. M
Jr
: Soc. Auto. Eng., May 1973 , 1780 (Reprint No. 730543) ; Mach. Des ., 1971 , 43 , (16) , 58 .
11.
Hintermann
H. E.
Gass:
H.
Oberfltiche-Surface , 1971 , 12 , (10) , 177 ; Schweizer Archly. , 1967 ,33 , (6) , 157 .
12.
Haskell
R. W.
Byrne:
J. G.
'Treatise on materials science and technology', (ed.
Herman
H.
), Vol. 1 , 293 ; 1972 , New York , London, Academic Press .
13.
Béguin
C.
: Metall , 1974 , 1 , 21 .
14.
Archer
N. J.
: Chem. Eng. (London) , Dec. 1974 , 780; Anon.: Des. Eng. , Nov. 1971 , 76 .
15.
Lewin
R. H.
Hayman:
C.
British Patent No.1 326 769,1973;USPatent No,3 814 625 ,1974 .
16.
Archer
N. J.
: Ref. 8, p.556 .
17.
'Metals handbook',
(ed.
Lyman
T.
), 8 ed. , Vol. 2 ; 1964 , Metals Park , Ohio, American Society for Metals .
18.
Reisman
A.
Sedgwick
T. O.
: 'Phase diagrams: materials science and technology' , (ed.
Alper
A. M.
), Vol. IV , 1 ; 1976 , New York , Academic Press .
19.
Saunders
E.
et al.: Ref. 4 ,p. 217 .
20.
Armas
B.
et al.: J. Electrochem. Soc ., 1976 , 123 , 308.
21.
Berg
R. S.
Mattox:
D. M.
Ref. 7 , p. 196 .
22.
Seltzer
R.
: Circuits Manuf. ,1975 ,15 , (10) , 26 .
23.
Takahashi
R.
et al.: J. Electrochem. Soc ., 1972 , 119 , 1406 .
24.
Mantle
H.
et al.: Ref. 8, p. 540 .
25.
Chin
J.
: Ref. 6, p. 164 .
26.
Bryant
W. A.
Meier:
G. H.
Ref. 8 , p. 161 .
27.
Wachtell
R. L.
: Ref. 1, p. 105 .
28.
Walsh
P. N.
: Ref. 7, p. 147 .
29.
Matuschka
A. G. V.
: 'Borierent; 1975 , Vevey , Switzerland, Delta-Verlag AG .
30.
Levine
S. R.
Caves:
R. M.
J.Electrochem. Soc. , 1974 , 121, 1051;
Trenouth:
J. M.
ibid. , 1975 , 122 , 835 .
31.
Yoshioka
S.
Takayanagi
S.
ibid ., 1967 , 116 , 962 .
32.
Blass
K. H.
et al.: Ref. 8, P. 136;
Papke
J. A.
Stevenson:
R. D.
Ref. 4, 13 ). 193 .
33.
Sladek
K. J.
Gilbert:
W. W.
Ref. 6, p. 215; R. L. Hough: Ref. 6 , p. 232 .
34.
Gates
J. E.
et al.: US Patent No. 3 951 612 , 1976 .
35.
Sugiyama
K.
et al.: J.Electrochem.Soc ., 1975 , 122 , 1545 .
36.
Dismukes
J. P.
et al.: Ref. 7, p. 275 .
37.
Morin
D.
Leclercq:
M.
French Patent No. 2232 613 , 1975
38.
Holland
L
: Thin Solid Films , 1975 , 27 , 185 .
39.
Yee
K. K.
: Ref. 8, p. 283 .
40.
Withers
J. C.
McCandless:
L. C.
Ref. 5 , p.393 .
41.
Viguié
J. C.
Spitz:
J.
J. Electrochem.Soc. , 1975 , 122 , 585; J. C. Viguié: Ref. 1, p. 169; G. Blandenet et al.: Ref. 8 , p. 190 .
42.
Bunshah
R. F.
: Ref. 1, p. 361 .
43.
Bunshah
R. F.
Raghuram
A. C.
: J. Vac. Sci. Technol ., 1972 , 9 , 1385 .
44.
Kosicki
B. B.
Kahng
D.
ibid ., 1969 ,6 , 593 .
45.
Alexander
J. H.
et al.: 'Thin film dielectrics', (ed.
Vratny
F.
), 186 ; 1969 , New York , Electro-chemical Society .
46.
Wauk
M. T.
Winslow
D. K.
: Appl. Phys.Lett ., 1968 , 13 , 286 .
47.
Auwarter
M.
: US Patent No . 2 920 002 , 1960 .
48.
Gereth
R.
Scherber
W.
J. Electrochem Soc ., 1972 , 119 , 1248 .
49.
RuZiCka
M.
, Czech. J. Phys ., 1974 , B24 , 465.
50.
Koenings
J.
et al.: Ref. 8, p. 270; D. Kiippers et al.: J.Electrochem.Soc ., 1976 , 123 , 1079 .
51.
Holland
L.
: Ref. 1, p. 369 .
52.
Campbell
D. S.
: Thin Solid Films , 1976 , 32 , 3 .
53.
Kominiak
G. J.
: J. Electrochem. Soc ., 1975 , 122 , 1271 .
54.
Mogab
C. F.
et al.: ibid ., 1975 , 122 , 815.
55.
Geraghty
K. G.
Donaghey
L. F.
: ibid ., 1976 , 123 , 1201 .
56.
Nakamura
K.
et al.: J. Jpn Inst. Met ., 1974 ,38 , 913 .
57.
Sproul
W. D.
Richman:
M. H.
Thin SolidFilms , 1975 , 28, L39:
Carson:
W. W.
J. Vac. Sci. Technol. , 1975 , 12 , 845.
58.
Haq
K. E.
: Appl. Phys. Lett. ,1975 , 26 , 255.
59.
Mattox
D. M.
: J. Vac. Sci. Technol., 1973 , 10 , 47; Proceedings of the Sixth International Conference on Electron and Ion Beam Science and Technology , 1974 , p. 254; Jpn J. Appl. Phys., 1974 , Suppl. 2 , Pt.
1,443 .
60.
Carpenter
R.
: Ref. 1, p. 393 .
61.
Leder
L. B.
: Met. Finish ., 1974 , 72 , (3 ), 41 .
62.
Spalvins
T.
: ibid ., 1974 , 72 , (6 ), 38 .
63.
Teer
D. G.
: Tribology Int ., 1975 ,8 , (6 ), 247 .
64.
Aisenberg
S.
Chabot
R. W.
: J. Vac. Sci. Technol ., 1973 , 10 , 104 .
65.
Matsubara
K.
et al.: Proceedings of theSixth International Vacuum Congress, 1974 , Jpn J. Appl. Phys ., 1974 , Suppl. 2 , Pt. 1,455 .
66.
Stowell
W. R.
Chambers
D.
J. Vac. Sci.Technol ., 1974 , 11 , 653 .
67.
Stowell
W. R.
: Thin Solid Films , 1974 , 22 , 111 .
68.
Kennedy
K. D.
Scheuermann:
G. R.
US Patent No. 3 900 592 , 1975 .
69.
Komiya
S.
Tsuruoka
K.
J. Vac.Sci. Technol ., 1976 , 13 , 520 .
70.
Chin
J.
Elsner:
N. B.
Ref. 8, p. 241 ; J. Vac. Sci. Technol ., 1975 ,12 , 821.
71.
Tibbetts
G. G.
: J. Appl. Phys ., 1974 ,45 , 5072 .
72.
Knorr
K.
Leslie
J. D.
: Thin Solid Films , 1974 , 23 , 101 .
73.
Blocher
J. M
Jr
: Ref. 7, p. 5 .
74.
Bre
L. E.
cher: ibid ., p. 340 .
75.
Bryant
W. A.
Meier
G. H.
: J. Electrochem. Soc ., 1973 , 120 , 559 .
76.
Curtis
B. J.
: ibid ., 1976 , 123 , 437.
77.
Truex
T. J.
et al.: ibid ., 1975 , 122 , 1396 .
78.
Ban
V. S.
Gilbert:
S. L.
ibid. , 1975 , 122 , 1382; V. S. Ban: ibid. , 1975 , 122 , 1389.
79.
Lin
S. S.
: ibid ., 1975 , 122 , 1405
80.
Vasile
M. J.
Smolinsky:
G.
Int J. Mass. Spectrom. Ion Phys. , 1975 , 18 , 179; ibid. , 1976 , 21, 263 ; ibid. , 1976 , 22 , 171.
81.
Kroll
M.
: J. Chem. Phys ., 1975 ,63 , 319 .
82.
Beutler
H.
et al.: Ref. 8, p. 749, and references therein .
83.
Sedgwick
T. O.
Smith
J. E.
, Jr: J. Electro-chem. Soc .,1976 , 123 , 254 .
84.
Cochet
G.
et al.: Ref. 8, p. 43 .
85.
'High-temperature materials and technology',
(eds.
Campbell
I. E.
Sherwood
E. M.
); 1967 , New York , Wiley .
86.
Toth
L. E.
: 'Transition metal carbides and nitrides'; 1971 , New York , London, Academic Press .
87.
Storms
E. K.
: 'The refractory carbides'; 1967 , New York , Academic Press .
88.
'Refractory carbides',
(ed.
Samsonov
G. V.
); 1974 , New York , Consultants Bureau .
89.
'The oxide handbook',
(ed.
Samsonov
G. V.
); 1973 , New York , IFI/Plenum .
90.
Raghuram
A. C.
Bunshah
R. F.
: J. Vac. Sci. Technol ., 1972 ,9 , 1389 .
91.
Blocher
J. M
Jr
: ibid ., 1974 , 11 ,680 .
92.
Raghuram
A. C.
et al.: Thin Solid Films , 1974 , 20 , 187.
93.
Grossklaus
W.
Bunshah
R. F.
: J. Vac. Sci. Technol ., 1975 , 12 , 811 .
94.
Kieffer
R.
et al.: Powder Metall.Int., 1973 , 5 , (4) , 188 ; R. Kieffer et al.: Metall , 1972 , 26 , 128.
95.
Aggour
L.
et al.: High Temp.—High Pressures , 1974 , 6 , 73 .
96.
Wahl
G.
: Z. Werkst. Tech ., 1976 , 7 , 311 .
97.
Harris
R.
et al.: Ref. 6 ,p. 183 .
98.
Bryant
W. A.
Meier:
G. H.
J. Vac. Sci. Technol ., 1974 , 11,719; W. A. Bryant, Ref. 5 , p. 409 .
99.
Federer
J. I.
Poteat:
L. E.
Ref. 6, p. 591 .
100.
Ruppert
W.
: Ref. 6, p. 340 .
101.
Glaski
F. A.
: Ref. 7, p. 521 .
102.
Bunshah
R. F.
: J. Vac. Sci. Technol ., 1974 ,11 , 633 .
103.
Gass
H.
et al.: Ref. 8, p. p . 99.
104.
Schachner
H.
et al.: Ref. 8, p. 485; H. Schachner et al.: US Patent No. 3 885 063 , 1975 .
105.
Funk
R.
et al.: J. Electrochem. Soc., 1976 , 123 , 285;
Lindstribm
J. N.
Johannesson
R. T.
: ibid. , 1976 , 123 , 555.
106.
Takahashi
T.
Kamiya
H.
J. Cryst. Growth , 1974 , 26 , 203 .
107.
Wakefield
G. F.
et al.: Ref. '7,p. 173; C. L. Yaws and G. F. Wakefield: Ref. 7, p. 577 .
108.
Reedy
C. D
Jr
: US Patent No. 3 807 008, 1974. 109„ A.A.Cochran et al.: J. Met ., 1970 , 22 , (8 ),37 .
109.
Politycki
A.
Hieber:
K.
Ref. 1, p. 59 .
110.
Ebersbach
G.
et al.: die Technik , 1969 , 24 , p. 526 .
111.
Komatsu
N.
et al.: US Patent No. 3 857 725 , 1974 .
112.
Hakim
M. J.
: Ref. 8, p. 634 .
113.
Hertz
D.
et al.: High Temp.—High Pressures , 1974 ,6 , 423.
114.
Lyudvinskaya
T. A.
et al.: Ref. 88, p. 39 .
115.
Heffernan
W. J.
et al.: Ref. 7, p.498 .
116.
Nimmagadda
R.
Bunshah
R. F.
: J. Vac. Sci. Technol ., 1975 , 12 , 585 .
117.
Nickl
J. J.
et al.: J. Less-Common Met ., 1972 , 26 , 335.
118.
Ebersbach
G.
et al.: die Technik , 1974 , 29 , 273.
119.
Tarver
D. A.
: US Patent No . 3 574 672 , 1971 .
120.
Wallace
T. C.
: Ref. 7, p. 91 .
121.
Ikawa
K.
et al.: US Patent No. 3 804 664 , 1974 .
122.
Chu
T. L.
Kelm
R. W.
Jr
: J. Electrochem. Soc ., 1975 , 122, 995, and references therein.
123.
Yoshida
S.
et al.: Appl. Phys. Lett ., 1975 , 26 , 461 .
124.
Pierson
H. O.
: J. Compos. Mater ., 1975 , 9 , 228 .
125.
Oya
G. I.
Onodera
Y.
J. Vac. Sci. Technol ., 1970 , 7 , (6 ),S44 .
126.
Gavaler
J. R.
et al.: ibid ., 1969 ,6 , 177.
127.
Hieber
K.
: Thin Solid Films , 1974 , 24 , 157 .
128.
Kilbane
F. M.
Habig:
P. S.
J. Vac. Sci. Technol. , 1975 ,12 , 107;
Langley
R. A.
Sharp:
D. J.
ibid. , 1975 , 12 , 155.
129.
Duffy
M. T.
Kern
W.
RCA Rev ., 1970 , 31 , 754 .
130.
Ferrieux
E.
Pruniaux
B.
J. Electrochem. Soc ., 1969 , 116 , 1008 .
131.
Balog
M.
et al.: J. Cryst. Growth , 1972 , 17 , 298 .
132.
Wang
C. C.
et al.: RCA Rev ., 1970 , 31 , 728.
133.
Graham
J.
: High Temp.—High Pressures , 1974 ,6 , 57'7 .
134.
Middelhoek
J.
Klinkhamer:
A. J.
Ref. 8, p. 19; G. Wahl: Ref. 8, p. 391 .
135.
Kern
W.
et al.: RCA Rev ., 1976 , 37 , 3 .
136.
Tabata
O.
: Ref. 8, p. 681 .
137.
Kane
J.
et al.: J. Electrochem. Soc ., 1975 , 122 , 1144 .
138.
Hieber
K.
Stolz:
M.
Ref. 8, p. 436 .
139.
Takahashi
T.
Itoh
H.
J. Less-Common Met ., 1974 , 38 , 211 .
140.
Grossklaus
W.
Bunshah
R. F.
: J. Vac. Sci. Technol ., 1975 , 12 , 593 .
141.
Colen
M.
Bunshah:
R. F.
ibid ., 13 , 536 .
142.
Lindström
J. N.
et al.: US Patent No. 3837896 , 1974
143.
Kunst
H.
: J. Less-Common Met ., 1975 ,43 , 307 .
144.
Armas
B.
Ducarroir:
M.
Ref. 7, p. 181 .
145.
Hayman
C.
Restall
J. E.
: J. Less-Common Met ., 1969 , 19 , 9 .
146.
Motojima
S.
et al.: J. Cryst. Growth , 1975 ,30 , 233 .
147.
Bonetti
R.
et al.: Ref. 8, p. 495 .
148.
Vandenbulcke
L.
Vuillard
G.
J. Electro-chem. Soc ., 1976 , 123 , 278 .
149.
Schintlmeister
W.
and a Pacher: J. Vac. Sci. Technol. , 1975 , 12 , 743; Metall , 1974 , 28 , 690.
150.
Nickl
J. J.
Braunmiihl
C. von
: J. Less-Common Met ., 1974 , 37 , 317 .
151.
Gaind
A. K.
et al.: Ref. 8, p. 30 .
152.
Silvestri
V. J.
et al.: J. Electron. Mater ., 1975 , 4 , 429.
153.
Lo
J.-S.
et al.: Ref.?, p. 74 .
154.
Gass
H.
Hintermann:
H. E.
Ref. 7, p. 563 .
155.
Hintermann
H. E.
et al.: Ref. 6, p. 352 .
156.
Pollard
F. H.
Woodward
P.
Trans. Faraday Soc ., 1950 , 46 , 190 .
157.
Archer
N. J.
Yee:
K. K.
Wear (in press) .
158.
Stähli
G.
Beutler
H.
Sulzer Tech. Rev . 1976 , 58 , (1 ), 33 .
159.
Meyer
K. H.
: Ref. 6, p. 625 .
160.
Haskell
R. W.
Imam:
A. R.
Ref. 8, p. 829 .
161.
Sherwood
P. J.
et al.: Ref. 8, p. 801 .
162.
Shroff
A. M.
et al.: Ref.?, p. 237 .
163.
Felix
P. C.
Beutler:
H.
Ref. 6, p.600; P. Felix and E. Erdös: Werkst. Korros. , 1972 , 8 , 627 .
164.
Hough
R. L.
: Ref. 5, p. 537 .
165.
Arthur
G.
Johnson:
M. P.
Ref. 8, p. 509 .