Lithography provides a high speed method of printing conducting circuit tracks and, potentially, multilayer devices on flexible substrates. The technique relies on the ability to formulate, mix, and print highly filled, powder containing inks. The problem is that the addition of powder at the 40 vol.-% level and above severely embrittles the dried ink film. Furthermore, increasing the build thickness by multiple overprinting increases the stress on bending. Additions to the ink that modify viscosity are known to result in loss of print quality. This paper reports ink formulation and testing that provide flexible ceramic and metal filled inks within these processing constraints.
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