Abstract
Owing to ingredient segregation, non-uniform microstructure and porosity defects in Cr–Cu alloys are frequently produced by melting process. Even subsequent heat treatment and hot working would not be able to completely resolve the problem. Therefore, this study investigated Cr60Cu40 alloy targets produced via vacuum sintering followed by hipping. Experimental results showed that the relative density of the sintered Cr60Cu40 alloy targets reached 99·69%, the apparent porosity decreased to 0·31% and transverse rupture strength increased to 553 MPa after hipping treatment at 1050°C at 175 MPa for 4 h. In addition, the closed pores were almost completely eliminated after the hipping treatment. The resistivity decreased to 643×10−8 Ω cm, and the International Annealed Copper Standard value was enhanced to 26·81% after optimal hipping treatment. This study shows that hipping treatment can effectively eliminate internal pores of sintered Cr60Cu40 alloy targets and also improve their electrical properties.
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