In the present study, sintering response of pure tin is assessed and correlated with microstructure and tensile behaviour following extrusion. This study was undertaken as there is no information in public domain on tin which is emerging as an interconnect material in its nearly pure forms. Benchmarking was carried out with unsintered tin as the recrystallisation temperature of tin is much lower than ambient temperature. Results revealed that energy efficient microwave sintered samples exhibit superior combination of microstructure and tensile properties when compared to unsintered and conventionally sintered samples.
SchafferJ. P., SaxenaA., AntolovichS. D., SandersT. H. and WarnerS. B.: ‘The science and design of engineering materials’, 2nd edn; 1999, New York, McGraw-Hill.
7.
GermanR. M.: ‘Sintering theory and practice’, 68-72, 95-121; 1996, New York, John Wiley and Sons Inc.
8.
RoyR., AgrawalD. K. and ChengJ.: US Patent 6183689 Bl, 2001.
9.
UpadhyayaA., SethiG. and AgrawalD. K.: Proc. Sintering 2003 Conf. on ‘Microwave sintering of Cu-12Sn alloy’, University Park, PA, USA, September 2003, Penn State University, 1-15.
10.
ChengJ., AgrawalD. K., KomaneniS., MattisM. and RoyR.: Mater. Res. Innov., 1997, 1, 44–52.
11.
AnklekarR. M., AgrawalD. K. and RoyR.: Powder Metall, 2001, 44, 355–362.
12.
RödigerK., DreyerK., GerdesT. and Willert-PoradaM.: Int. J Refract. Met. Hard Mater., 1998, 16, 409–416.
13.
RoyR., ChengJ. and AgrawalD. K.: US Patent 6365885 Bl, 2002.
14.
GuptaM. and WongW. L. E.: Ser. Mater., 2005, 52, 479–483.
