Replication of plastic thin film by microfeature mould in large area hot embossing

Abstract

This study determines the replication property and surface roughness of microfeatures of a Ni mould that combines electroforming and large area hot embossing. The metal mould first uses a 4 in. silicon wafer to fabricate a master using the UV-LIGA method, and then applies the sputtering method to sputter the copper element as the seed layer on the surface of the master. The electroforming method is used to manufacture the Ni mould insert from the master with the seed layer. Finally, this study uses thin film of polymethyl methacrylate (PMMA) material to replicate the microfeatures of Ni mould insert by large area hot embossing. This study shows the replication properties and surface roughness of different microfeature shapes and sizes for the Ni mould insert and moulded PMMA on large area hot embossing. Experimental results show the average error in height of the microfeature is 0·61 μm for the Ni mould insert and moulded PMMA. The average error in surface roughness of the microfeature is 1·63 nm for the Ni mould insert and moulded PMMA. Experimental results show the good replication and surface roughness of moulded PMMA are replicated from the Ni mould insert by large area hot embossing.