A fatigue model based on entropy generation is presented and validated through experiments. This model is purely physical and combines statistical mechanics with thermodynamic laws applied at a local scale. The model does not require an empirical damage surface or phenomenological constitutive modeling constants. Damage evolution parameter varies from 0 to 1. As it is for the irreversible internal entropy production, this parameter is a non-decreasing quantity that increases with the degradation of a material.
NaderiM., AmiriM. and KhonsariM. M.: ‘On the thermodynamic entropy of fatigue fracture’, Proc. R. Soc. London A, 2009, 466, 423–438.
2.
BasaranC. and NieS.: ‘An irreversible thermodynamic theory for damage mechanics of solids’, Int. J. Damage Mech., 2004, 13, 205–224.
3.
BasaranC., NieS., GomezJ., GunelE., LiS., LinM., TangH., YanC., YaoW. and YeH.: ‘Thermodynamic theory for damage evolution in solids’, 2014;. in ‘Handbook of damage mechanics’. 721–762..
4.
TangH. and BasaranC.: ‘A damage mechanics based fatigue life prediction model for solder joints’, Trans. ASME, 2003, 125, 120–125.
5.
KimD., DargushG. and BasaranC.: ‘A cyclic two-surface thermoplastic damage model with application to metallic plate dampers’, Eng. Struct., 2013, 52, 608–620.
6.
BasaranC. and NieS.: ‘A thermodynamics based damage mechanics model for particulate composites’, Int. J. Solids Struct., 2007b, 44, 1099–1114.
7.
AmiriM. and KhonsariM. M.: ‘On the role of entropy generation in processes involving fatigue’, Entropy, 2012, 14, 24–31.
8.
BasaranC. and YanC. Y.: ‘A thermodynamic framework for damage mechanics of solder joints’, Trans. ASME, 1998, 120, 379–384.
9.
BasaranC. and TangH.: ‘Implementation of a thermodynamic framework for damage mechanics of solder interconnects in microelectronic packaging’, Int. J. Damage Mech., 2002, 11, (1), 87–108.
10.
YeH., BasaranC. and HopkinsD.: ‘Damage mechanics of microelectronics solder joints under high current densities’, Int. J. Solids Struct., 2003, 40, (15), 4021–4032.
11.
BasaranC., LinM. and YeH.: ‘A thermodynamic model for electrical current induced damage’, Int. J. Solids Struct., 2003, 40, (26), 7315–7327.
12.
YeH., BasaranC. and HopkinsD.: ‘Mechanical degradation of microelectronics solder joints under current stressing’, Int. J. Solid Struct., 2003, 40, (26), 7269–7284.
13.
GomezJ. and BasaranC.: ‘A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effect’, Int. J. Solids Struct., 2005, 42, (13), 3744–3772.
14.
BasaranC., ZhaoY., TangH. and GomezJ.: ‘A damage mechanics based unified constitutive model for solder alloys’, Trans. ASME, 2005, 127, (3), 208–214.
15.
GomezJ. and BasaranC.: ‘Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm’, Mech. Mater., 2006, 38, 585–598.
16.
GomezJ., LinM. and BasaranC.: ‘Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging’, Multidiscipline Model. Mater. Struct., 2006, 2, (3), 309–326.
17.
BasaranC. and NieS.: ‘A thermodynamics based damage mechanics model for particulate composites’, Int. J. Solids Struct., 2007a, 44, 1099–1114.
18.
BasaranC. and LinM.: ‘Damage mechanics of electromigration in microelectronics copper interconnects’, Int. J. Mater. Struct. Integrity, 2007, 1, (1/2/3), 16–39.
19.
BasaranC. and LinM.: ‘Damage mechanics of electromigration induced failure’, Mech. Mater., 2008, 40, 66–79.
20.
LiS., AbdulhamidM. and BasaranC.: ‘Simulating damage mechanics of electromigration and thermomigration simulation’, Trans. Soc. Model. Simul. Int., 2008, 84, (8/9), 391–401.
21.
GomezJ. and BasaranC.: ‘Computational implementation of cosserat continuum’, Int. J. Mater. Prod. Technol., 2009, 34, (1/2), 3–36.
22.
LiS. and BasaranC.: ‘A computational damage mechanics model for thermomigration’, Mech. Mater., 2009, 41, (3), 271–278.
23.
LiS., AbdulhamidM., BasaranC. and LaiY. S.: ‘Damage mechanics of low temperature electromigration and thermomigration’, IEEE Trans. Adv. Packag., 2009, 32, (2), 478–485.
24.
LiS., SellersM. S., BasaranC., SchultzA. J. and KofkeD. A.: ‘Lattice Strain due to an atomic vacancy’, Int. J. Mol. Sci., 2009, 10, 2798–2808.
25.
YaoW. and BasaranC.: ‘Electromigration analysis of solder joints under AC load: a mean time to failure model’, J. Appl. Phys., 2012, 111, (6)
26.
Al-RubR. K. A. and VoyiadjisG. Z.: ‘Analytical and experimental determination of the material intrinsic length scale of strain gradient plasticity theory from micro-and nano-indentation’, Int. J. Plast., 2004, 20, 1139–1182.
27.
VoyiadjisG. Z. and Al-RubR. K. A.: ‘Gradient plasticity theory with a variable length scale parameter’, Int. J. Solid Struct., 2005, 42, 3998–4029.
28.
ShahbeykS., HosseiniM. and YaghoobiM.: ‘Mesoscale finite element prediction of concrete failure’, Int. J. Comput. Mater. Sci., 2011, 50, (7), 1973–1990.
29.
YaghoobiM. and VoyiadjisG. Z.: ‘Effect of boundary conditions on the MD simulation of nanoindentation’, Comput. Mater. Sci., 2014, 95, 626–636.
30.
VoyiadjisG. Z. and YaghoobiM.: ‘Large scale atomistic simulation of size effects during nanoindentation: dislocation length and hardness’, Mater. Sci. Eng. A, 2015, A634, 20–31.
