Interfacial structure and strength on Ti(C,N) joint using liquid phase diffusion bonding with Ti/Ni interlayer

Abstract

Partial transient liquid phase diffusion bonding (PTLP-DB) on Ti(C,N) cermet was studied in the present paper using Ti/Ni/Ti foil sandwich structure as the interlayer. The interfacial structure and element distribution at the interface were observed using SEM, electron probe microanalysis and X-ray diffraction. The joint strength was measured using four-point bending test. The results showed that metallurgical bonding between Ti(C,N) cermet was achieved using PTLP-DB. Near Ti(C,N) cermet side, a strong chemical reaction occurred to produce an interfacial multilayer containing Ti–Al and Ti–Ni intermetallics. Different bonding times during PTLP-DB were also studied, and there was an optimum time during bonding. With a shorter bonding time, voids were observed at the interface, while with a prolonged time, the bending strength on the joints also decreased due to the overgrowth on intermetallic layer and the existence of high gradient residual stress at the interface.