The transient liquid phase bonding of 6061-15 wt-%SiCp composite using 50 μm thick copper powder interlayer at 560°C temperature, 0·2 MPa pressure, with five different holding times (20 min, 1, 2, 3 and 6 h) in argon environment has been investigated. The rejection of oxide at periphery on completion of isothermal solidification and elimination of void at bond interface through solid state diffusion were the main reasons of achieving adequate joint efficiency (89%) with 6 h holding.
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