Abstract
Investigations of the electrical resistivity of liquid Sn–20 wt-%Sb alloy as a function of temperature were carried out by dc four probe method. An abnormal change on the resistivity–temperature curve was observed in temperature interval of 850–980°C, which indicated that temperature induced liquid–liquid structure transitions (TI-LLST) occurred with temperature rising. Further explorations of effects of TI-LLST on solidification showed that the undercooling for primary or peritectic phase crystallisation increased for the samples solidified from the melt experienced the TI-LLST, and the size of primary phase decreased markedly.
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