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Abstract

Microforging of a gold ball on aluminium coated silicon substrate is an important process step during the interconnection of gold wires in microelectronics industry. Understanding the deformation mechanism helps to achieve the required deformed profile of the ball with maximum shear strength of the weld and minimum residual stress in the weld so as to avoid cratering of the silicon die. In the present paper, finite element based numerical modelling is well described to understand the stress and the deformation behaviour during such deformation process. In addition, experiments have been conducted to validate the numerical prediction in terms of the ball deformation. Numerical results show that maximum stress is induced at the SiO₂ interface during the peak impact load application. Additionally the effect of additional ultrasonic energy during ball deformation and the growth of the intermetallics on the gold wirebond's integrity are discussed in detail.

Keywords

WIREBONDING DISLOCATION ULTRASONIC DIFFUSION INTERMETALLICS PACKAGING

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Critical study of microforging Au ball on Al coated silicon substrate using finite element method

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