This paper reports in detail the experimental investigation of the effect of rapid thermal cycling on microstructure and growth of the intermetallic compound (IMC) layer at the interface between Sn–3·0Ag–0·5Cu solder and Cu substrate. With the application of electromagnetic induced heating, the specimen was rapidly heated and cooled based on a control system that employs a fuzzy logic algorithm. The temperature distribution in the solder joint was simulated and analysed. The experimental results showed that the predicted temperature profile approximates the results of measurement. It was found that the rapid thermal cycling had an evident influence on the microstructure of a single solder joint. The thickness of the IMC layer grew gradually with the cycling temperature during the test period. In addition, heterogeneous coarsening occurred between the IMC and Cu substrate. The growth characteristics of the IMC layer showed a sawtooth-like profile along the subplate's sides from 60 to 200°C.
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