Transient liquid phase (TLP) bonding of TiAl/Ti6242 with Ti

Abstract

Defect-free joints of TiAl/Ti6242 have been produced by TLP bonding using Ti, Cu foils as insert metals. The influence of the bonding parameters such as bonding pressure, bonding temperature, dwell time and the stacking sequence of the parent materials on the microstructure of the joined zone has been investigated. The results showed that bonding pressure played an important role even though there was a liquid phase during bonding. The stacking sequence of the parent materials also had a major effect on joint formation. Elimination of defects at the interface of the TiAl/ interlayer in order to obtain sound joints was a major problem. Similar interface structures were observed in all cases except that the thickness of the joined zone was different. The results of the study revealed that the surface oxide layer on TiAl had a major effect on the interface diffusion process. Based on the interface diffusion and interface structure, the joint formation process has been investigated and a mechanism for the effect of experimental parameters on joint formation has been proposed.

Keywords

TLP BONDING INTERMETALLICS HEAT RESISTANCE ALLOY INTERFACE STRUCTURE

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References

Siren

, Bohm

K.-H.

, Appel

and Koçak

: Proc. Welding Conf. LUT Join ’99: Int. Conf. on Efficient Welding in Industrial, Applications (ICEWIA), Lappeenranta, August 1999, p. 12.

Cam

and Kocak

: J. Mater. Sci., 1999, 34, 3345–3354.

Madhusudhan Reddy

, Mohandas

and Chandreshekar

: Sci. Technol. Weld. Joining, 2001, 6, 300–304.

Shirzadi

A. A.

and Wallach

E. R.

: Sci. Technol. Weld. Joining, 1997, 2, 89–94.

Khan

T. I.

and Wallach

E. R.

: J. Mater. Sci., 1996, 31, 2937–2943.

Macdonald

W. D.

and Eagar

T. W.

: ‘The metal science of joining’, (ed. M. J. Cieslak, J. H. Perepezko, S. Kand and M. E. Glicksman), 93–100; 1992, The Minerals, Metals & Materials Society.

Kim

J. J.

, Park

J.-W.

and Eagar

T. W.

: Mater. Sci. Eng. A, 2003, 344, 240–244.

Zhang

J. X.

, Chandel

R. S.

, Chen

Y. Z.

and Seow

H. P.

: J. Mater. Process. Technol., 2002, 122, 220–225.

Orel

S. V.

, Parous

L. C.

and Gale

W. F.

: Weld. J., 1995, 74, 319s–324s.

10.

Gale

W. F.

and Orel

S. V.

: J. Mater. Sci., 1996, 31, 345–349.

11.

Gale

W. F.

and Guan

: Metall. Mater. Trans. A, 1996, 27A, 3621–3629.

12.

Moore

T. J.

and Kalinowski

J. M.

: Mater. Res. Soc. Symp. Proc., 1993, 288, 1173–1178.

13.

Strum

M. J.

and Henshall

G. A.

: ‘Advanced joining technologies for new materials II’ (ed. N. F. Flore and J. O. Stiegler), 76–88; 1994, Miami, FL, AWS.

14.

Butts

D. A.

, Gale

W. F.

and Zhou

: 6th Int. Trends in Welding Research Conference Proceedings, April 2002, Pine Mountain, GA, ASM International, 2003, pp. 495–499.

15.

Fergus

J. W.

, Zhou

, Dang

and Gale

W. F.

: 6th Int. Trends in Welding Research Conference Proceedings, April 2002, Pine Mountain, GA, ASM International, 2003, pp. 799–803.

16.

Dogan

and Schwalbe

K.-H.

: ‘Mechanical and fracture behaviour of Ti–6Al–2Sn–4Zr–2Mo–0 1Si alloys’, Report of Institute for Materials Research, GKSS Research Center, 1990.

17.

Hansen

P. M.

: ‘Constitution of binary alloy’, Metallurgy and Metallurgical Engineering Series, 643; 1958, New York, McGraw-Hill Book Co. Inc.

18.

Nakao

, Nishimoto

, Shinozaki

and Kang

: ‘Proceedings Superalloys 1989’, Metallurgical Society of AIME, pp. 775–783.

Transient liquid phase (TLP) bonding of TiAl/Ti6242 with Ti–Cu foil

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